Method and apparatus for creating a bond between objects based on formation of inter-diffusion layers

ABSTRACT

The present disclosure provides a method of creating a bond between a first object and a second object. For example, at least one insert may be provided at a location in a space formed between the first object and the second object. In additional, a filler material may be provided proximal to the location. An inter-diffusion layer may be formed, wherein a first portion of the inter-diffusion layer is formed by diffusion between the filler material and the at least one insert, wherein a second portion of the inter-diffusion layer is formed between the filler material and the first object, wherein a third portion of the inter-diffusion layer is formed between the filler material and the second object, wherein the first portion is coadunate with each of the second portion and third portion.

RELATED APPLICATIONS

This application is a Division of U.S. application Ser. No. 15/176,567filed Jun. 8, 2016, which issues on Feb. 16, 2021 as U.S. Pat. No.10,923,454, which claims priority to U.S. Provisional Application No.62/173,057 filed Jun. 9, 2015, which are incorporated herein byreference.

It is intended that each of the referenced applications may beapplicable to the concepts and embodiments disclosed herein, even ifsuch concepts and embodiments are disclosed in the referencedapplications with different limitations and configurations and describedusing different examples and terminology.

FIELD OF DISCLOSURE

The present disclosure generally relates to creating a bond betweenobjects based on formation of inter-diffusion layers. More specifically,the present disclosure relates to creating a bond between metallicobjects through formation of a contiguous inter-diffusion layer.

BACKGROUND

The required operating temperature for some electronic applications suchas, for example, deep oil exploration, aerospace, and automotive, haveincreased beyond the current available die attach materials. The currentaim now exceeds more than 250° C. for long periods of time, for examplea few years. One important issue of the current high temperature dieattach materials is the lead content, which has environmental hazardsand its poisonous nature to species. On the other hand, the reliabilityof the current die attach materials deteriorates while being stored athigh temperatures, and testing these materials can be very timeconsuming before being operational. Therefore, there is a need for dieattach materials without any harmful elements or chemicals, which canwithstand high temperatures of more than 250° C. for long periods oftime without showing any loss of strength over conventional hightemperature storage tests to fulfil the reliability requirement for thelong operation times.

When two materials are in contact, inter-diffusion at the interfacebetween them may improve their adhesion. However, this phenomenon mayresult in reduction of adhesion strength to a third material. The interdiffusion of the first and second material, such as, for example, themating surface of substrate and die attach material, may weaken theattachment to the third material, such as, for example, the die.

BRIEF OVERVIEW

A thermally resistant connection for high temperature die attachmentsmay be provided. This brief overview is provided to introduce aselection of concepts in a simplified form that are further describedbelow in the Detailed Description. This brief overview is not intendedto identify key features or essential features of the claimed subjectmatter. Nor is this brief overview intended to be used to limit theclaimed subject matter's scope.

An object with a mating surface may attach to another object withanother mating surface by creating an inter-diffusion layer. Theinter-diffusion layer may be supplemented by an insert layer.Furthermore, the inter-diffusion layer may be supplemented by varyingthe surface geometry of either or both of the objects to be attached.

Accordingly, in some embodiments, the present disclosure provides amethod of creating a bond between a first object and a second object. Insome embodiments, the first object may be comprised in a substrate, suchas for example, a semiconductor substrate. Accordingly, the secondobject may be comprised in a semiconductor die. Accordingly, the bondmay facilitate attaching of the semiconductor die to the substrate.

The method may include a step of filling a space between the firstobject and the second object with a filler material. Further, in someembodiments, the filler material may be a bonding material. Forinstance, the filler material may include sintered silver nanoparticles.

Further, the method may include a step of heating the filler material tofacilitate formation of a plurality of inter-diffusion layers.

Due to the heating, a first inter-diffusion layer may be formed betweenthe filler material and the first object. Further, a secondinter-diffusion layer may be formed between the filler material and thesecond object. The plurality of inter-diffusion layers may provide aphysical bond between the first object and the second object. Further,in some embodiments, the plurality of inter-diffusion layers may provideat least one of a thermal conduction and electrical conduction betweenthe first object and the second object.

Furthermore, in some embodiments, the first inter-diffusion layer may becontiguous with the second inter-diffusion layer. For example, when thespacing between the first object and the second object is reduced, thefirst inter-diffusion layer may overlap with the second inter-diffusionlayer. Alternatively and/or additionally, the material characteristicsof the first object, the filler material and the second object may besuch that an extent of inter-diffusion may be large enough to result inan overlap of the inter-diffusion layer with the inter-diffusion layer.

In some embodiments, contiguity of the first inter-diffusion layer withthe second inter-diffusion layer may further enhance mechanical, thermaland/or electrical characteristics of the bond between the first objectand the second object.

Further, in some embodiments, a space between the first object and thesecond object may include at least one insert. Accordingly, in someembodiments, the method may further include placing the at least oneinsert in the space.

Further, in some embodiments, the at least one insert may be comprisedin at least one of the first object and the second object. Accordingly,the method may further include a step of forming the at least one inserton at least one of the first object and the second object. The formingof the at least one insert may be performed using techniques such asetching, depositing, milling, patterning and so on.

Additionally, as result of the heating, a third inter-diffusion layermay be formed between the at least one insert and the filler material.Further, the third inter-diffusion layer may be contiguous with each ofthe first inter-diffusion layer and the second inter-diffusion layer. Asa result, the use of the at least one insert may facilitate formation ofa contiguous plurality of inter-diffusion layers.

Both the foregoing brief overview and the following detailed descriptionprovide examples and are explanatory only. Accordingly, the foregoingbrief overview and the following detailed description should not beconsidered to be restrictive. Further, features or variations may beprovided in addition to those set forth herein. For example, embodimentsmay be directed to various feature combinations and sub-combinationsdescribed in the detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this disclosure, illustrate various embodiments of the presentdisclosure. The drawings contain representations of various trademarksand copyrights owned by the Applicants. In addition, the drawings maycontain other marks owned by third parties and are being used forillustrative purposes only. All rights to various trademarks andcopyrights represented herein, except those belonging to theirrespective owners, are vested in and the property of the Applicants. TheApplicants retain and reserve all rights in their trademarks andcopyrights included herein, and grant permission to reproduce thematerial only in connection with reproduction of the granted patent andfor no other purpose.

Furthermore, the drawings may contain text or captions that may explaincertain embodiments of the present disclosure. This text is included forillustrative, non-limiting, explanatory purposes of certain embodimentsdetailed in the present disclosure. In the drawings:

FIG. 1A illustrates a method for formation of a connection or attachmentof two surfaces by formation of a continuous inter-diffusion layer fromone of the surfaces to another, in which placement of inserts in betweenthe surfaces establishes the continuity;

FIGS. 1B, 1C and 1D illustrate a cross section, showing formation of aconnection or attachment of two surfaces by formation of a continuousinter-diffusion layer from one of the surfaces to another, in whichplacement of inserts in between the surfaces establishes the continuity;

FIGS. 2A, 2B and 2C illustrate a cross section, showing formation of aconnection or attachment of a surface to another surface by formation ofa continuous inter-diffusion layer from one of the surfaces to an insertand another continuous inter-diffusion layer from that insert to theother surface;

FIG. 3A illustrates a method for formation of a connection or attachmentby diffusion of a material inside a gap between the two surfaces, whichis formed by continuous inter-diffusion layer inside the gap from one ofthe surface to the other surface;

FIGS. 3B and 3C illustrate a cross section, showing formation of aconnection or attachment by diffusion of a material inside the gapbetween the two surfaces, which is formed by continuous inter-diffusionlayer inside the gap from one of the surface to the other surface;

FIG. 4A illustrates a cross-section showing formation of a plurality ofinter-diffusion layers as a result of performing a method of creating abond between a first object and second object according to someembodiments;

FIG. 4B illustrates a cross-section showing formation of a contiguousplurality of inter-diffusion layers as a result of performing a methodof creating a bond between a first object and second object according tosome embodiments;

FIG. 5A illustrates a cross-section of a placement of a first object, asecond object, a filler material and an insert in order to create a bondbetween the first object and the second object in accordance with someembodiments;

FIG. 5B illustrates a cross-section showing a contiguous plurality ofinter-diffusion layers that provides a bond between the first object andthe second object using the insert in accordance with some embodiments;

FIG. 5C illustrates a cross-section of a placement of a first object, asecond object, a filler material and an insert in physical contact withthe first object and the second object in order to create a bond betweenthe first object and the second object in accordance with someembodiments;

FIG. 5D illustrates a cross-section showing a contiguous plurality ofinter-diffusion layers that provides a bond between the first object andthe second object in accordance with some embodiments;

FIG. 6A illustrates a cross-section of a placement of a first object, asecond object, a filler material and a plurality of widely spacedinserts in order to create a bond between the first object and thesecond object in accordance with some embodiments;

FIG. 6B illustrates a cross-section showing a contiguous plurality ofinter-diffusion layers that provides a bond between the first object andthe second object using the plurality of widely spaced inserts inaccordance with some embodiments;

FIG. 6C illustrates a cross-section of a placement of a first object, asecond object, a filler material and a plurality of closely spacedinserts in order to create a bond between the first object and thesecond object in accordance with some embodiments;

FIG. 6D illustrates a cross-section showing a contiguous plurality ofinter-diffusion layers that provides a bond between the first object andthe second object using the plurality of closely spaced inserts inaccordance with some embodiments;

FIG. 7A illustrates a cross-section of a placement of a first object anda second object made of one metal and an insert made of another metal inorder to create a bond between the first object and the second object inaccordance with some embodiments;

FIG. 7B illustrates a cross-section showing a contiguous, heterogeneousplurality of inter-diffusion layers that provides a bond between thefirst object and the second object in accordance with some embodiments;

FIG. 7C illustrates a cross-section of a placement of a first objectmade of one metal, a second object made of another metal and an insertmade of yet another metal in order to create a bond between the firstobject and the second object in accordance with some embodiments;

FIG. 7D illustrates a cross-section showing a contiguous, heterogeneousplurality of inter-diffusion layers that provides a bond between thefirst object and the second object in accordance with some embodiments;

FIG. 8A illustrates a cross-section of a placement of a first object, asecond object, a filler material and a plurality of inserts in order tocreate a bond between the first object and the second object inaccordance with some embodiments;

FIG. 8B illustrates a cross-section showing a contiguous plurality ofinter-diffusion layers that provides a bond between the first object andthe second object using the plurality of inserts in accordance with someembodiments;

FIG. 9A illustrates a cross-section of a placement of a first object, asecond object, a filler material and a plurality of inserts formed onthe first object in order to create a bond between the first object andthe second object in accordance with some embodiments;

FIG. 9B illustrates a cross-section showing a contiguous plurality ofinter-diffusion layers that provides a bond between the first object andthe second object using the plurality of inserts formed in the firstobject in accordance with some embodiments;

FIG. 10A illustrates a cross-section of a placement of a first object, asecond object, a filler material and a plurality of inserts formed oneach of the first object and the second object in order to create a bondbetween the first object and the second object in accordance with someembodiments;

FIG. 10B illustrates a cross-section showing a contiguous plurality ofinter-diffusion layers that provides a bond between the first object andthe second object using the plurality of inserts formed in each of thefirst object and the second object in accordance with some embodiments;

FIG. 11 illustrates a method of creating a bond between a first objectand a second object in accordance with some embodiments;

FIG. 12 illustrates a method of creating a bond between a first objectand a second object involving placement of an insert in accordance withsome embodiments;

FIG. 13 illustrates a method of creating a bond between a first objectand a second object involving formation of an insert on at least one ofthe first object and the second object in accordance with someembodiments;

FIG. 14 illustrates a method of creating a bond between a first objectand a second object involving placement of an insert and introduction offiller material in accordance with some embodiments; and

FIG. 15 illustrates a method of creating a bond between a first objectand a second object in accordance with some embodiments.

DETAILED DESCRIPTION

As a preliminary matter, it will readily be understood by one havingordinary skill in the relevant art that the present disclosure has broadutility and application. As should be understood, any embodiment mayincorporate only one or a plurality of the above-disclosed aspects ofthe disclosure and may further incorporate only one or a plurality ofthe above-disclosed features. Furthermore, any embodiment discussed andidentified as being “preferred” is considered to be part of a best modecontemplated for carrying out the embodiments of the present disclosure.Other embodiments also may be discussed for additional illustrativepurposes in providing a full and enabling disclosure. As should beunderstood, any embodiment may incorporate only one or a plurality ofthe above-disclosed aspects of the display and may further incorporateonly one or a plurality of the above-disclosed features. Moreover, manyembodiments, such as adaptations, variations, modifications, andequivalent arrangements, will be implicitly disclosed by the embodimentsdescribed herein and fall within the scope of the present disclosure.

Accordingly, while embodiments are described herein in detail inrelation to one or more embodiments, it is to be understood that thisdisclosure is illustrative and exemplary of the present disclosure, andare made merely for the purposes of providing a full and enablingdisclosure. The detailed disclosure herein of one or more embodiments isnot intended, nor is to be construed, to limit the scope of patentprotection afforded in any claim of a patent issuing here from, whichscope is to be defined by the claims and the equivalents thereof. It isnot intended that the scope of patent protection be defined by readinginto any claim a limitation found herein that does not explicitly appearin the claim itself.

Thus, for example, any sequence(s) and/or temporal order of steps ofvarious processes or methods that are described herein are illustrativeand not restrictive. Accordingly, it should be understood that, althoughsteps of various processes or methods may be shown and described asbeing in a sequence or temporal order, the steps of any such processesor methods are not limited to being carried out in any particularsequence or order, absent an indication otherwise. Indeed, the steps insuch processes or methods generally may be carried out in variousdifferent sequences and orders while still falling within the scope ofthe present invention. Accordingly, it is intended that the scope ofpatent protection is to be defined by the issued claim(s) rather thanthe description set forth herein.

Additionally, it is important to note that each term used herein refersto that which an ordinary artisan would understand such term to meanbased on the contextual use of such term herein. To the extent that themeaning of a term used herein—as understood by the ordinary artisanbased on the contextual use of such term—differs in any way from anyparticular dictionary definition of such term, it is intended that themeaning of the term as understood by the ordinary artisan shouldprevail.

Regarding applicability of 35 U.S.C. § 112, ¶6, no claim element isintended to be read in accordance with this statutory provision unlessthe explicit phrase “means for” or “step for” is actually used in suchclaim element, whereupon this statutory provision is intended to applyin the interpretation of such claim element.

Furthermore, it is important to note that, as used herein, “a” and “an”each generally denotes “at least one,” but does not exclude a pluralityunless the contextual use dictates otherwise. When used herein to join alist of items, “or” denotes “at least one of the items,” but does notexclude a plurality of items of the list. Finally, when used herein tojoin a list of items, “and” denotes “all of the items of the list.”

The following detailed description refers to the accompanying drawings.Wherever possible, the same reference numbers are used in the drawingsand the following description to refer to the same or similar elements.While many embodiments of the disclosure may be described,modifications, adaptations, and other implementations are possible. Forexample, substitutions, additions, or modifications may be made to theelements illustrated in the drawings, and the methods described hereinmay be modified by substituting, reordering, or adding stages to thedisclosed methods. Accordingly, the following detailed description doesnot limit the disclosure. Instead, the proper scope of the disclosure isdefined by the appended claims. The present disclosure contains headers.It should be understood that these headers are used as references andare not to be construed as limiting upon the subjected matter disclosedunder the header.

The present disclosure includes many aspects and features. Moreover,while many aspects and features relate to, and are described in, thecontext of die attachments, embodiments of the present disclosure arenot limited to use only in this context. Furthermore, although variousembodiments are disclosed with reference to a two-object operatingenvironment, a plurality of objects may be attached using the methodsand systems disclosed herein. Other applications consistent withembodiments disclosed herein may be used with, for example, wire bondingand welding.

I. Overview

Consistent with embodiments of the present disclosure, a thermallyresistant connection for high temperature die attachments may beprovided. This overview is provided to introduce a selection of conceptsin a simplified form that are further described below. This overview isnot intended to identify key features or essential features of theclaimed subject matter. Nor is this overview intended to be used tolimit the claimed subject matter's scope. The thermally resistantconnection for high temperature die attachments may be used byindividuals or companies to create a die attachment connection that canoperate at and withstand high temperatures.

High temperature die attachment may be used for attaching, for example,electronic components to an electronic substrate in applications suchas, for example, deep oil exploration, aerospace, and automotiveapplications. Embodiments of the present disclosure may create anattachment with the use of an inter-diffusion layer.

The inter-diffusion layer may be created, at least in part, with the useof an insert layer. The insert layer may sit between the objects to beattached. The insert layer may have space for inserting a fillermaterial, such as, for example, a bonding material. Further, the insertlayer material may have a custom profile. The custom profile may beselected or determined based on a desired properties of the attachment(e.g., thermal connectivity, porosity, and the like). Accordingly, theinsert layer may be comprised of, for example, a mesh screen of aspecified density. Alternatively, or in addition to the insert layer,the surface profiles of the objects to be attached may be contoured tofurther enable inter-diffusion between the objects. For example, in someembodiments, the objects may have contours deposited, patterned ormilled out.

The space between the objects and the insert layer may further be filledwith a filler material. The filler material may be, for example, but notlimited to, a bonding material. The filler material may diffuse with atleast one of the other materials during the inter-diffusion process.

Advantages over prior art may include:

-   -   1) Lead-free high temperature die attach, which has        environmental benefits;    -   2) No need to reach melting point of any element, which is an        advantage over Solid-Liquid Inter-Diffusion (SLID) systems;    -   3) No need to reach high processing temperatures close to the        melting point of the die attach materials, which can prevent        formation of residual stresses inside the joint;    -   4) No need to use applied processing pressure on the die, which        is advantageous over both SLID, micro and nano-particle        sintering, and diffusion wielding (diffusion bonding)        techniques;    -   5) The system strengthens over time at high temperatures;    -   6) Controlled porosity;    -   7) Easy prediction of the final structure after storage at high        temperature and control over design of the final required        structure;    -   8) Formation of a mostly void free layer as a section or all of        the joint or interconnect as a result of the continuous        inter-diffusion layer;    -   9) Can be used for large die sizes, which is an advantage over        sintering techniques, which have problem with build-up of        combusted organics inside the die attach, which can reduce the        die attach strength, and also large die sizes can prevent oxygen        penetration and stop perfect sintering to occur in the center;        and    -   10) Controllable thermal and electrical conductivity as a result        of selection of the material combinations and desired        inter-diffusion layer.

Both the foregoing overview and the following detailed descriptionprovide examples and are explanatory only. Accordingly, the foregoingoverview and the following detailed description should not be consideredto be restrictive. Further, features or variations may be provided inaddition to those set forth herein. For example, embodiments may bedirected to various feature combinations and sub-combinations describedin the detailed description.

II. Configuration

An operating environment associated with embodiments of the presentdisclosure may be comprised of two objects to be connected by dieattachment. For example, one object may be an electrical component andthe other object may be a substrate. The objects may have varioussurface conditions and profiles.

The objects may be connected by a continuous inter-diffusion layer. Insome embodiments, the inter-diffusion layer may be supplemented with aninsert layer. The insert layer may be placed between the two objects.The insert layer may take the form of a variety of shapes and sizes. Theform of the insert layer may be designed to accommodate instruments,such as, for example, wires with cross sections within the operatingenvironment. Moreover, the top and bottom surfaces of the insert layermay vary depending based on the characteristics of the operatingenvironment, including, for example, properties of the objects beingattached. For example, the surfaces may be conductive or nonconductive.

The one or more of the bonding surfaces (e.g., mating surface) of theobjects may be contoured to enhance diffusion and contiguity of theinter-diffusion layers. For example, profiles may be deposited into orpatterned or milled out of an object's surface.

Constituent with embodiments of the present disclosure, the surfaceprofile of the objects, the insert layer in between the objects, orboth, may create a space between the objects. The space between theobjects, in turn, may further be filled with a filler material. Thefiller material is preferably a bonding material.

In some embodiments, the inter-diffusion layer may be formed chemicallyto form an intermetallic inter-diffusion layer. In other embodiments,the inter-diffusion layer may be formed without chemical reactions toform a miscible mixture. Still in other embodiments, the inter-diffusionlayer may form a combination of intermetallic compounds and misciblemixtures.

III. Operation

Although the stages illustrated by the flow charts are disclosed in aparticular order, it should be understood that the order is disclosedfor illustrative purposes only. Stages may be combined, separated,reordered, and various intermediary stages may exist. Accordingly, itshould be understood that the various stages illustrated within the flowcharts may be, in various embodiments, performed in arrangements thatdiffer from the ones illustrated. Moreover, various stages may be addedor removed from the flow charts without altering or deterring from thefundamental scope of the depicted methods and systems disclosed herein.Ways to implement the stages of methods 100, 300, 1100, 1200, 1300, 1400and 1500 will be described in greater detail below.

FIG. 1A is a flow chart setting forth the general stages involved in amethod 100 consistent with an embodiment of the disclosure for providinga thermally resistant connection for high temperature die attachments.Method 100 illustrates a method for forming a connection or attachmentof two surfaces by formation of a continuous inter-diffusion layer fromone of the surfaces to another, in which placement of inserts in betweenthe surfaces establishes the continuity.

FIGS. 1B, 1C and 1D illustrate a cross section, showing formation of aconnection or attachment of two surfaces by formation of a continuousinter-diffusion layer from one of the surfaces to another, in whichplacement of inserts in between the surfaces establishes the continuity.

Method 100 may begin at starting block 109 and proceed to stage 110,where an insert layer is selected. An object 101, which may be, forexample, an electronic component, with a mating surface 102 is subjectto attachment or establishment of a connection to object 103, which maybe, for example, an electronic substrate, with mating surface 104.Inserts 106 (e.g., may be one or more inserts, without altering thescope of the present disclosure), in this case represented as bars withrectangular cross sections, may have any shapes and sizes depending onthe application and instruments, such as, for example, wires withcircular cross sections. Inserts 106 may have surfaces 105.

From stage 110, where the insert layer is selected, method 100 mayproceed to stage 120, where the insert layer and filler material may beplaced between objects to be attached. The inserts may be placed inbetween the mating surfaces 102 and 104. The space formed by theseparation between the mating surfaces 102 and 104, while the insertsare there, may be filled with a material 107, as shown in FIG. 1C. Invarious embodiments, material 107 is preferentially a bonding material.

From stage 120, where the insert layer and filler material is placedbetween the objects to be attached, method 100 may proceed to stage 130,where the materials may be inter-diffused. Inter-diffusion of thematerial 107 with mating surfaces 102, 104, and 105 may form acontinuous inter-diffusion layer 108. The continuous inter-diffusionlayer 108 may form an interconnection, joint or attachment of object 101to object 103.

The inter-diffusion mechanism depends on the application, such as, forexample, thermal diffusion for high temperature electronic applications,or diffusion as a result of high current density in power electronicsapplications. As an example, this inter-diffusion layer may be formed bya chemical reaction and, for example, form an intermetallic compound, orwithout chemical reaction and, for example, form a miscible mixture ofmaterials 107 and materials on the mating surfaces 102, 104 and surfaces105. The continuous inter-inter-diffusion layer can also be a mixture ofan intermetallic layer with a miscible mixture.

If the desired bond properties between the two objects are reached,method 100 may end at stage 150. Alternatively, the materials may bemodified to produce the desired bond properties.

For improvements on the mechanical abilities of the continuousinter-diffusion layers 108, the shape and separation of the inserts 106may be optimized, which can be dependent on the properties of theinter-diffusions and the initial characterizations of materials 107 andmating surfaces' 102, 104 and 105 materials.

This inter-diffusion may result in movement of atoms of the fillermaterial 107 towards the surfaces 102, 104 and 105. Therefore, theinitial porosity of the mating surfaces 102, 104 and 105 or the material107 may be used to end up with final desired porosity shown in FIG. 1Dinside the continuous inter-diffusion layer 108. The initial design andshape of the inserts and mating surfaces may be varied to form therequired final pores inside the continuous inter-diffusion layer. Also,this technique may enable control over the porosity after establishmentof the diffusion mechanisms. For example, by increasing the initialporosity of material 107, the flexibility of the final assembly may beimproved. Alternatively, reduction in the porosity and reduction in thehorizontal widths of inserts 106 may cause the continuousinter-diffusion layers 108 to thicken and therefore strengthen forbetter mechanical performance. While the above examples are used to showpossible outcomes, results may vary depending on the application.

To enable the inter-diffusions, the mixing energy of the materials 107with mating surfaces 102, 104, and 105 may be lower than their unmixedenergy to increase the attraction for diffusion. In addition, thisinter-diffusion layer may also result in a chemical reaction to form anelement or molecule as the continuous inter-diffusion layer, such as anintermetallic compound.

One example of this method may be utilized in attachment of anelectronic chip to a substrate with gold mating surfaces. The method maybegin by filling a gold mesh (with for example 20 μm thickness, squareholes with 30 μm length and Sum bar width) with a silver bondingmaterial. Next, the method may continue by placing the filled gold meshin between the substrate and chip. The silver bonding materials can bemade out of silver nanoparticle (NP) paste. The silver NP paste may thenbe sintered as a bonding material after placement between the chip andsubstrate. One benefit of silver nanoparticles may be formation of manygrain and twin boundaries inside the sintered materials [S. A. Paknejad,G. Dumas, G. West, G. Lewis, S. H. Mannan, Microstructure evolutionduring 300° C. storage of sintered Ag nanoparticles on Ag and Ausubstrates, Journal of Alloys and Compounds, Volume 617, 25 Dec. 2014,Pages 994-1001, ISSN 0925-8388,http://dx.doi.org/10.1016/j.jallcom.2014.08.062.]. The highconcentration of the grain and twin boundaries may increase the rate ofthe diffusion mechanisms and speed up the formation of the continuousinter-diffusion layer. Also, the sintered silver NPs can have initialporosity of for example 20%, which after the diffusions will end up inthe middle of the continuous inter-diffusion layer, which may finallyproduce the assembly shown in FIG. 1D.

This design enables densification of the continuous inter-diffusionlayer at high temperatures. Such densification of the continuousinter-diffusion layer at high temperatures may emphasize on the factthat high temperatures can increase the mechanical strength of the jointtill the diffusion stops and may leave a stable structure at hightemperatures. (See “Thermally stable high temperature die attachsolution.” Materials & Design 89 (2016): 1310-1314.http://dx.doi.org/10.1016/j.matdes.2015.10.074 by Paknejad, Seyed Amir,Ali Mansourian, Yohan Noh, Khalid Khtatba, and Samjid H. Mannan.) Thetop and bottom surfaces of the inserts 106 may vary depending on theapplication. For example, they may be conductive or nonconductive.

The inserts may be in any form and sizes. Some examples of inserts mayinclude electrodeposited mesh structures with parallel or crossing barsor wires, and woven mesh structures. The inserts may also be patterned,grown, and/or deposited on the object 101 and/or object 103.

The density of the inserts 106 may vary in different locations betweenobjects 101 and 103. For example, at the center the density may behigher to increase the mechanical strength, while, closer to the edges,the density may be lower or with diagonal orientations to compensate forthe coefficient of thermal expansion mismatch between the objects 101and 103 and the inserts 106.

Further, in some embodiments, the at least one insert 106 may beconfigured to enable a gap within the at least one insert 106 or a gapbetween at least a couple of inserts to reach an edge of at least one ofthe first object 101 and the second object 103. Further, the gap allowsvapors to travel into a space surrounding at least one of the firstobject 101 and the second object 103. Method 100 may be implemented information of a connection or attachment of a surface to another surfaceby formation of a continuous inter-diffusion layer from one of thesurfaces to an insert and another continuous inter-diffusion layer fromthat insert to the other surface as shown in FIGS. 2A, 2B, and 2C.

FIGS. 2A, 2B, and 2C illustrates a cross section, showing formation of aconnection or attachment of a surface to another surface by formation ofa continuous inter-diffusion layer from one of the surfaces to an insertand another continuous inter-diffusion layer from that insert to theother surface.

Method 100 may begin at starting block 109 and proceed to stage 110,where an insert layer is selected. An object 201, such as, for example,an electronic component with a mating surface 202, is a subject ofattachment or establishment of a connection to object 203, which may bean electronic substrate, with mating surface 204. In this case, inserts206 are represented in bars with rectangular cross sections with matingsurfaces 205, which may have any shapes and sizes depending on theapplication and instruments. The inserts may be placed in between themating surfaces 202 and 204.

From stage 110, where the insert layer is selected, method 100 mayproceed to stage 120, where the insert layer and filler material may beplaced between objects to be attached. The space formed by theseparation between the mating surfaces 202 and 204, while the insertsare there, may be filled with a material 207, as shown in FIG. 2B,preferentially a bonding material.

From stage 120, where the insert layer and filler material are placedbetween the objects to be attached, method 100 may proceed to stage 130,where the materials may be inter-diffused. Inter-diffusion of thematerial 207 with mating surfaces 202, 204, and 205 may form twocontinuous inter-diffusion layers 208 along the mating surfaces 205 tothe mating surfaces 202 and 204 and also can be continuousinter-diffusion layer in between the gap formed from the mating surfaces205 with the mating surfaces 202 and/or 204. In addition, the insertscan be connected to each other before or after formation of theinter-diffusion layer for further stability. Such continuous layer mayform an interconnection, joint or attachment of object 201 and object203 to inserts 206, which then would mean the objects 201 and 203 areattached together. This inter-diffusion may attract the filler materials207 into the gap between the mating surfaces of 205 and 202 as well asgap between mating surfaces 205 and 204. The inter-diffusion mechanismmay depend on the application, such as, for example, thermal diffusionfor high temperature applications. As an example this inter-diffusionlayer may be formed by a chemical reaction and, for example, form anintermetallic compound or without chemical reaction and, for example,form a miscible mixture of materials 207 and materials on the matingsurfaces 202, 204 and 205. The continuous inter-diffusion layer may alsobe a mixture of intermetallic compounds with miscible mixtures.

If the desired bond properties between the two objects are reached,method 100 may end at stage 150. Alternatively, the materials may bemodified to produce the desired bond properties. Modifications to thematerials and diffusion methods may be varied as discussed above toachieve desired bond properties.

FIG. 3A is a flow chart setting forth the general stages involved in amethod 300 consistent with an embodiment of the disclosure for providinga thermally resistant connection for high temperature die attachments.Method 300 illustrates a method for forming a connection or attachmentby diffusion of a material inside a gap between the two surfaces, whichmay be formed by continuous inter-diffusion layer inside the gap fromone of the surface to the other surface.

FIGS. 3B, and 3C illustrate a cross section, showing formation of aconnection or attachment by diffusion of a material inside a gap betweenthe two surfaces, which is formed by continuous inter-diffusion layerinside the gap from one of the surface to the other surface.

Method 300 may begin at starting block 309 and proceed to stage 310,where object surface profiles may be selected. An object 301, which canbe an electronic component, with a mating surface 302 is the subject ofattachment or establishment of a connection to object 303, which can bean electronic substrate, with mating surface 304. Structures 305 on theobjects 301 and 303 as shown in FIG. 3B with rectangular cross sections,may have any shapes and sizes depending on the application andinstruments and may or may not be symmetric or similar. The structures305 can also only be on one of the objects 301 or 303. The varioussurface profiles may be deposited, patterned or milled out of objects301 and/or 303.

From stage 310, where object surface profiles may be selected, method300 may proceed to stage 320, where filler material may be placedbetween the objects to be attached. The space formed by the separationbetween the structures 305 and the mating surfaces 302 and 304 may befilled with a material 306, preferentially a bonding material.

From stage 320, where filler material is placed between the objects tobe attached, method 300 may proceed to stage 330, where the materialsmay be inter diffused. Inter-diffusion of the material 306 with at leastone of the mating surfaces 302 and/or 304 may form a continuousinter-diffusion layer 308 forming interconnection, joint or attachmentof object 301 to object 303. This inter-diffusion may attract thematerials inside the gap 307 between the mating surfaces of 302 and 304and improve the attachment. There also can be no gap 307 between themating surfaces 302 and 304 and the inter-diffusion layer may becontinuous from the edges of the structures 305 on both objects 301 and303 for establishment of the joint, attachment or interconnection of theobjects 301 and 303 by inter-diffusion among materials 306 and matingsurfaces 302 and 304. The inter-diffusion mechanism may depend on theapplication, such as, for example, thermal diffusion for hightemperature electronic applications. As an example this inter-diffusionlayer can be formed by a chemical reaction and, for example, form anintermetallic compound or without chemical reaction and, for example,form a miscible mixture of materials 306 and materials on the matingsurfaces 302 and 304. The continuous inter-diffusion layer may also be amixture of intermetallic compounds with miscible mixtures.

If the desired bond properties are achieved, method 300 may end at stage350. Alternatively, the materials may be modified to produce the desiredresult. Modifications to the materials and diffusion methods may bevaried as discussed above to achieve desired bond properties.

Various elements may be used in conjunction with embodiments of thepresent disclosure. The elements include, but are not limited to, forexample, Cu, Ag, Au, Al, Pt, Ti, Tw, Ni, Ta, Pd, Sn, Zn, Pb (only forspecial applications), Sb, Bi, Cd, Si, Ge, and In.

Any of the 102, 104, 105, 107, 202, 204, 205, 207, 302, 304, and 306 maybe made from them, any combinations or alloys of them, or be made out oftheir oxides.

The whole inserts 106 and 206, and structures 305 can also be involvedinto the diffusion and be part of the inter-diffusion layers 108, 208,and 308. In addition, inserts 106 and 206 may be connected or attachedtogether inside or outside the separation between objects 101 and 103 incase of inserts 106 or separation between objects 201 and 203 in case ofinserts 206. These connections of inserts may achieve improvedmechanical properties and stability and support for other inserts andconsequently improved mechanical stability of the inter-diffusion layers108 and 208 in order.

Any of the materials 107, 207, and 306 could have been pre-deposited,milled or patterned on any of the objects subject of being attached orconnected.

Further, the present disclosure also provides a method 1100, asillustrated in FIG. 11, of creating a bond between a first object 402and a second object 404 as illustrated in FIG. 4A and FIG. 4B. Further,in some embodiments, the first object 402 may be comprised in asubstrate, such as for example, a semiconductor substrate. Accordingly,the second object 404 may be comprised in a semiconductor die. Further,the bond may facilitate attaching of the semiconductor die to thesubstrate.

In some embodiments, the first object 402 and/or the second object 404may include one or more metals, such as, but not limited to, Cu, Ag, Au,Al, Pt, Ti, Tw, Ni, Ta, Pd, Sn, Zn, Pb (only for special applications),Sb, Bi, Cd, Si, Ge, and In. For instance, in some embodiments, each ofthe first object 402 and the second object 404 may include at least onemetal, such as Gold (Au).

The method 1100 may include a step 1110 of filling a space between thefirst object 402 and the second object 404 with a filler material 406.Further, in some embodiments, the filler material 406 may be a bondingmaterial. For instance, the filler material 406 may include sinteredsilver nanoparticles.

Further, the method 1100 may include a step 1120 of heating the fillermaterial 406 to facilitate formation of a plurality of inter-diffusionlayers. Heating of the filler material 406 may be performed by directlyheating the filler material 406. Alternatively and/or additionally, oneor more of the first object 402 and the second object 404 may be heatedwhile the filler material 406 may receive heat through thermalconduction.

Further, in some embodiments, the heating may be performed to atemperature below a melting point of each of the first object 402, thesecond object 404, the filler material 406 and the at least one insert502.

Due to the heating, a first inter-diffusion layer 408 may be formedbetween the filler material 406 and the first object 402. Further, asecond inter-diffusion layer 410 may be formed between the fillermaterial 406 and the second object 404. The plurality of inter-diffusionlayers may provide a physical bond between the first object 402 and thesecond object 404. Further, in some embodiments, the plurality ofinter-diffusion layers may provide at least one of a thermal conductionand electrical conduction between the first object 402 and the secondobject 404.

In some embodiments, the method 1100 may further include applyingexternal pressure to at least one of the first object 402 and the secondobject 404 to further facilitate formation of the plurality ofinter-diffusion layers. Accordingly, in some embodiments, the pluralityof inter-diffusion layers may be formed under atmospheric pressure.

As a result of formation of the plurality of inter-diffusion layers, asillustrated in FIG. 4A, a path 412 for thermal and/or electricalconduction may be formed between the first object 402 and the secondobject 404. The path may begin from the first object 402, and passthrough each of the first inter-diffusion layer 408, the filler material406 and the second inter-diffusion layer 410 and finally end in thesecond object 404. Further, due to the material characteristics of thefirst inter-diffusion layer 408 and the second inter-diffusion layer410, the path 412 may be characterized by enhanced thermal and/orelectrical conduction. For instance, thermal, mechanical and/orelectrical characteristics associated with the bond between the firstobject 402 and the second object 404 may remain within an effectiverange even in the presence of extreme environments, such as hightemperature, high pressure etc.

Furthermore, in some embodiments, the first inter-diffusion layer 408may be contiguous with the second inter-diffusion layer 410 asillustrated in FIG. 4B. For example, when the spacing between the firstobject 402 and the second object 404 is reduced, the firstinter-diffusion layer 408 may overlap with the second inter-diffusionlayer 410. Alternatively and/or additionally, the materialcharacteristics or quantity of the first object 402, the filler material406 and the second object 404 may be such that an extent ofinter-diffusion may be large enough to result in an overlap of theinter-diffusion layer 408 with the inter-diffusion layer 410.

Accordingly, a path 414 for thermal and/or electrical conduction may beformed. The path may begin from the first object 402, and pass througheach of the first inter-diffusion layer 408 and the secondinter-diffusion layer 410 and finally end in the second object 404. Insome embodiments, contiguity of the first inter-diffusion layer 408 withthe second inter-diffusion layer 410 may further enhance mechanical,thermal and/or electrical characteristics of the bond between the firstobject 402 and the second object 404.

Further, in some embodiments, a space between the first object 402 andthe second object 404 may include at least one insert 502 as illustratedin FIG. 5A. Accordingly, in some embodiments, the method 1100 mayfurther include placing the at least one insert 502 in the space.

Further, in some embodiments, the at least one insert 502 may becomprised in at least one of the first object 402 and the second object404 as exemplarily illustrated in FIG. 9A, where the at least insert 502may include inserts 902 a-902 c. Accordingly, the method 1100 mayfurther include a step of forming the at least one insert 502 on atleast one of the first object 402 and the second object 404. The formingof the at least one insert 502 may be performed using techniques such asetching, depositing, milling, patterning and so on.

Further, the at least one insert 502 may be in physical contact with thefiller material 406. In some embodiments, the at least one insert 502may include an insert layer. Further, in some embodiments, the insertlayer may include a mesh screen.

Additionally, as result of heating, a third inter-diffusion layer 504may be formed between the at least one insert 502 and the fillermaterial 406. Further, the third inter-diffusion layer 504 may becontiguous with each of the first inter-diffusion layer 408 and thesecond inter-diffusion layer 410.

For example, due to placement of the at least one insert 502 as shown inFIG. 5A, the third inter-diffusion layer 504 may include inter-diffusionlayers 504 a to 504 d surrounding the at least one insert 502 as shownin FIG. 5B. Further, as shown, inter-diffusion layer 504 c may becontiguous with the first inter-diffusion layer 408. Similarly,inter-diffusion layer 504 d may be contiguous with the secondinter-diffusion layer 410. Further, inter-diffusion layer 504 c may becontiguous with inter-diffusion layer 504 d through each ofinter-diffusion layer 504 a and 504 b. Accordingly, paths of thermaland/or electrical conduction such as path 506 a and 506 b may be formed.

Alternatively, in some embodiments, the at least one insert 502 may beplaced as illustrated in FIG. 5C, where the at least one insert 502 maybe in physical contact with each of the first object 402 and the secondobject 404. Accordingly, as a result of the heating, the plurality ofinter-diffusion layers 504 a and 504 b as illustrated in FIG. 5D may beformed.

Further, in some embodiments, at least one of the first object 402, thesecond object 404, the at least one insert 502 and the filler material406 may include at least one of grain boundaries and twin boundarieswhich may facilitate formation of the plurality of inter-diffusionlayers. For instance, the filler material 406 such as sintered silvermay include many grain boundaries and twin boundaries which may enhancethe diffusion of gold atoms into sintered silver and allow for fastformation of the plurality of inter-diffusion layers. Additionally, insome instances, the presence of grain boundaries and twin boundaries mayfacilitate formation of the plurality of inter-diffusion layers withoutnecessarily applying external pressure. Accordingly, the first object402 and the second object 404 may be bonded under atmospheric pressure.

Further, in some embodiments, as illustrated in FIG. 6A, the at leastone insert 502 may include a plurality of inserts 602 a to 602 c. Theplurality of inserts, in some instances may be individual members.Alternatively, in some instances, the plurality of inserts 602 a to 602c may be physically connected to each other, for example, in the form ofa mesh screen. Accordingly, due to the heating, the plurality ofinter-diffusion layers as illustrated in FIG. 6B may be formed.

Further, a spacing of the plurality of inserts 602 a to 602 c may besuch that, the inter-diffusion layers formed around the inserts 602 a to602 c may not be physically contiguous. For instance, theinter-diffusion layer formed around the insert 602 a may not bephysically contiguous with the inter-diffusion layer formed eitheraround 602 b or 602 c. As a result, paths 604 for thermal and/orelectrical conduction may be formed between the first object 402 and thesecond object 404.

However, in some embodiments, as illustrated in FIG. 6C, a spacing ofthe plurality of inserts 602 a to 602 g may be such that, theinter-diffusion layers formed around the inserts 602 a to 602 g may bephysically contiguous. For instance, the inter-diffusion layer formedaround the insert 602 a may be physically contiguous with theinter-diffusion layer formed either around 602 b. As a result, paths 604for thermal and/or electrical conduction may be formed between the firstobject 402 and the second object 404. Further, the paths 604 may passthrough the contiguous, plurality of inter-diffusion layers formedaround the plurality of inserts 602 a-g.

Further, in some embodiments, each of the first object 402, the secondobject 404 and the at least one insert 502 may include of a metal, suchas Gold. Additionally, the plurality of inter-diffusion layers, such asfor example, inter-diffusion layers 504 a-d in FIG. 5, may behomogeneous.

Further, in some embodiments, as illustrated in FIG. 7A, each of thefirst object 402 and the second object 404 comprise a first metal, suchas, for example, Copper. Whereas, the at least one insert 502 mayinclude a second metal, such as, for example, Gold. Accordingly, theplurality of inter-diffusion layers, such as inter-diffusion layers 408,504 and 410 as illustrated in FIG. 7B may be heterogeneous.

Further, in some embodiments, as illustrated in FIG. 7C, the firstobject 402 may include a first metal such as Copper, the second object404 may include a second metal such as Aluminum and the at least oneinsert 502 may include a third metal such as Gold. Further, theplurality of inter-diffusion layers, such as inter-diffusion layers 408,504 and 410 as illustrated in FIG. 7D may be heterogeneous.

Further, in some embodiments, an inter-diffusion layer between thefiller material 406 and an object may be formed based on diffusion ofparticles from the filler material 406 into the object and diffusion ofparticles from the object into the filler material 406. Further, theobject may be one of the first object 402, the second object 404 and theat least one insert 502.

Further, in some embodiments, an inter-diffusion layer between thefiller material 406 and an object may be formed based on a chemicalreaction between the filler material 406 and the object. Further, theobject may be one of the first object 402, the second object 404 and theat least one inserts 502.

Further, in some embodiments, an inter-diffusion layer between thefiller material 406 and an object may be formed based onelectro-migration between the filler material 406 and the object.Further, the object may be one of the first object 402, the secondobject 404 and the at least one inserts 502.

Further, in some embodiments, the at least one insert 502 may beconfigured to enable a gap within the at least one insert 502 or a gapin between the at least two inserts 502 to reach an edge of at least oneof the first object 402 and the second object 404. Further, the gapallows vapors to travel into a space surrounding at least one of thefirst object 402 and the second object 404.

Further, in some embodiments, the at least one insert 502 may include aplurality of inserts, such as inserts 802 a to 802 c as illustrated inFIG. 8A. Further, the plurality of inserts 802 a-c span the space.Further, a first insert, such as insert 802 a, may be proximal to asurface of the first object 402 and the second insert, such as insert802 c, may be proximal to a surface of the second object 404.Accordingly, due to the heating, a plurality of inter-diffusion layers804, 806 and 808 may be formed as illustrated in FIG. 8B. Further, theplurality of inter-diffusion layers 804, 806 and 808 may facilitatethermal and/or electrical conduction between the first object 402 andthe second object 404.

Further, in some embodiments, the at least one insert 502 may include aplurality of inserts, such as inserts 902 a to 902 c as illustrated inFIG. 9A. Further, the inserts 902 a-c may be included in the firstobject 402. Accordingly, in some instances, the inserts 902 a-c may beformed on the first object 402 by one or more techniques such asetching, depositing, patterning, contouring and so on. Further, due tothe heating, the plurality of inter-diffusion layers 904 and 906 may beformed as illustrated in FIG. 9B.

Further, in some embodiments, the at least one insert 502 may include aplurality of inserts, such as inserts 1002 a to 1002 c and 1004 a-1004 cas illustrated in FIG. 10A. Further, the inserts 1002 a to 1002 c may beincluded in the first object 402. Similarly, the inserts 1004 a to 1004c may be included in the second object 404. Accordingly, in someinstances, the inserts 1002 a to 1002 c and 1004 a-1004 c may be formedon the first object 402 and the second object 404 respectively by one ormore techniques such as etching, depositing, patterning, contouring andso on. Further, due to the heating, the plurality of contiguousinter-diffusion layers 1006 and 1008 may be formed as illustrated inFIG. 10B.

Further, as illustrated in FIG. 12, a method 1200 of creating a bondbetween a first object 402 and a second object 404 according to someembodiments may be provided. The method 1200 may include a step 1210 offilling a space between the first object 402 and the second object 404with the filler material 406. Further, the method 1200 may include astep 1220 of placing the at least one insert 502 in the space.Additionally, the method may include a step 1230 of heating the fillermaterial 406 to facilitate formation of a contiguous plurality ofinter-diffusion layers.

Further, as illustrated in FIG. 13, a method 1300 of creating a bondbetween the first object 402 and the second object 404 according to someembodiments may be provided. The method 1300 may include a step 1310 offorming the at least one insert 502 on at least one of a first object402 and a second object 404. Further, the method 1300 may include a step1320 of filling the space between the first object 402 and the secondobject 404 with the filler material 406. Additionally, the method 1300may include a step 1330 of heating the filler material 406 to facilitateformation of a contiguous, plurality of inter-diffusion layers.

Further, as illustrated in FIG. 14, a method 1400 of creating a bondbetween the first object 402 and the second object 404 according to someembodiments may be provided. The method 1400 may include a step 1410 ofplacing the at least one insert 502 at a location in a space formedbetween the first object 402 and the second object 404. Further, themethod may include a step 1420 of introducing the filler material 406proximal to the location. Additionally, the method may include a step1430 of heating at least one of the at least one insert 502 and thefiller material 406. Further, the heating may facilitate formation of aninter-diffusion layer. Furthermore, a first portion of theinter-diffusion layer may be formed by diffusion between the fillermaterial 406 and the at least one insert 502. Likewise, a second portionof the inter-diffusion layer may be formed between the filler material406 and the first object 402. Additionally, a third portion of theinter-diffusion layer may be formed between the filler material 406 andthe second object 404. Further, the first portion may be contiguous witheach of the second portion and third portion. As a result, the firstobject 402 and the second object 404 may be connected through acontiguous plurality of inter-diffusion layers.

Further, as illustrated in FIG. 15, a method 1500 of creating a bondbetween a first object 402 and a second object 404 according to someembodiments may be provided. The method 1500 may include a step offilling a space between the first object 402 and the second object 404with the filler material 406. Additionally, the method may include astep of heating the filler material 406 to facilitate formation of aninter-diffusion layer from the first object 402 to the second object 404by diffusion of the filler material 406 inside a gap between the firstobject 402 and second object 404.

Further, a method of creating a bond between a first object 402 and asecond object 404 according to some embodiments is provided. The methodmay include a step of filling a space between the first object 402 andthe second object 404 with a filler material 406. Additionally, themethod may include a step of heating the filler material 406 tofacilitate formation a plurality of inter-diffusion layers. Further, afirst inter-diffusion layer 408 may be formed between the fillermaterial 406 and the first object 402. Further, a second inter-diffusionlayer 410 may be formed between the filler material 406 and the secondobject 404.

Further, in some embodiments, a semiconductor device formed based on oneor more methods of the present disclosure is also provided. Thesemiconductor device may include a semiconductor die and a substrate.Further, the semiconductor die may be attached to the substrate based ona bond formed between a first object 402 comprised in the semiconductordie and second object 404 comprised in the substrate. Further, the bondmay be created by a step of filling a space between the first object 402and the second object 404 with a filler material 406. Additionally, astep of heating the filler material 406 to facilitate formation aplurality of inter-diffusion layers may be performed. Further, a firstinter-diffusion layer 408 may be formed between the filler material 406and the first object 402. Further, a second inter-diffusion layer 410may be formed between the filler material 406 and the second object 404.Further, the first inter-diffusion layer 408 may be contiguous with thesecond inter-diffusion layer 410.

Further, in some embodiments, an electronic module formed based onmethods of the present disclosure is also provided. The electronicmodule may include a substrate and at least one chip. Further, a firstset of inserts may be placed inside a space between the substrate andthe at least one chip. Further, a second set of inserts may be placedinside a space formed by the substrate, the at least one chip and thefirst set of inserts. Further, diffusion of the second set of insertsoccurs into at least one of a space between the substrate's matingsurface and the at least one chip's mating surface, a gap between thefirst set of the inserts and the substrate and a gap between the firstset of inserts and the at least one chip. Further, the diffusion mayresult in formation of at least one of a continuous diffusion layer fromthe substrate to the at least one chip and a continuous diffusion layerfrom the first set of the inserts to the substrate and a continuousdiffusion layer from the first set of the inserts to the at least onechip.

The depicted embodiments in the figures are used as examples only. Forexample, in some embodiments, the vertical inter-diffusion layers may beconnected directly to the first object and the second object. In otherembodiments, the vertical inter-diffusion layers may only be connectedto the first object and the second via the horizontal inter-diffusionlayers. It should be understood that, while all variations are possible,the direct connection of the vertical inter-diffusion layers and thefirst and second objects are preferred.

The thermal and/or electrical conduction paths are not limited to thepaths shown in figures and also they may also work in the opposite way,for example, by insulating or reducing electrical and/or thermalconduction.

Any combination of any of the eight methods above or all of themtogether can also be used to produce an inter-connection, joint orattachment. Moreover, modifications to the methods above may be possibleto product the inter-connection without deviating from the spirit andscope of the present disclosure.

While the specification includes examples, the disclosure's scope isindicated by the following claims. Furthermore, while the specificationhas been described in language specific to structural features and/ormethodological acts, the claims are not limited to the features or actsdescribed above. Rather, the specific features and acts described aboveare disclosed as example for embodiments of the disclosure.

Insofar as the description above and the accompanying drawing discloseany additional subject matter that is not within the scope of the claimsbelow, the disclosures are not dedicated to the public and the right tofile one or more applications to claims such additional disclosures isreserved.

What is claimed is:
 1. An electronic module comprising: a substrate; atleast one chip; a plurality of inserts comprising: a first set ofinserts placed inside a space between the substrate and the at least onechip, a second set of inserts placed inside a space formed by thesubstrate, the at least one chip and the first set of inserts, whereindiffusion of the second set of inserts occurs into at least one of thefollowing: the substrate's mating surface, the at least one chip'smating surface and the first set of inserts; a gap between the first setof the inserts and the substrate; and a gap between the first set ofinserts and the at least one chip, wherein the diffusion results information of at least one of the following: a coadunate inter-diffusionlayer along at least one insert of the first set of inserts to the atleast one chip and a coadunate inter-diffusion layer along at least oneinsert of the first set of the inserts to the substrate.
 2. Theelectronic module of lain 1, wherein the at least one insert of thefirst set of inserts is comprised in at least one of the substrate'smating surface and the chip's mating surface.
 3. The electronic moduleof claim 1, wherein the at least one insert of the first set of insertsand the second set of inserts comprises a mesh screen.
 4. The electronicmodule of claim 1, wherein at least one of the coadunate interdiffusionlayers is formed through applying a minimum processing pressure of zero.5. The electronic module of claim 1, wherein the at least one insert ofthe first set of inserts and the second set of inserts feature comprisesa columnar structure.
 6. The electronic module of claim 1, wherein atleast one insert feature of the first set of inserts comprises aplurality of volumetrically dispersed insert features.
 7. The electronicmodule of claim 1, wherein at least one of the following: the first setof inserts and the second set of inserts is integrally formed with atleast one of the following: the substrate and the at least one chip. 8.The electronic module of claim 1, wherein at least one of the following:the first set of inserts and the second set of inserts is subjected to asintering process.
 9. The electronic module of claim 1, wherein at leastone of the following: the first set of inserts and the second set ofinserts is subjected to a soldering process.
 10. An electronic modulecomprising: a first object; a second object; at least one insert at alocation in a space formed between the first object and the secondobject; a filler material proximal to the location; and aninter-diffusion layer, wherein a first portion of the inter-diffusionlayer is formed by diffusion between the filler material and the atleast one insert, wherein a second portion of the inter-diffusion layeris formed between the filler material and the first object, wherein athird portion of the inter-diffusion layer is formed between the fillermaterial and the second object, wherein the first portion is coadunatewith each of the second portion and third portion.
 11. The electronicmodule of claim 10, wherein the at least one insert is comprised in atleast one of the following: the first object and the second object. 12.The electronic module of claim 10, wherein the at least one insertcomprises a mesh screen.
 13. The electronic module of claim 10, whereinforming the coadunate interdiffusion layer comprises applying a minimumprocessing pressure of zero.
 14. The electronic module of claim 10,wherein the at least one insert comprises a columnar structure.
 15. Theelectronic module of claim 10, wherein the at least one insert comprisesa plurality of volumetrically dispersed insert features.
 16. Theelectronic module of claim 10, wherein the at least one insert isintegrally disposed with at least one of the following: the first objectand the second object.
 17. The electronic module of claim 10, wherein atleast one insert is subjected to a sintering process.
 18. The electronicmodule of claim 10, wherein the filler material comprisesnanoparticulate silver, further wherein the at least one insertcomprises gold.
 19. The electronic module of claim 10, wherein the atleast one insert to a soldering process.
 20. A method of creating a bondbetween a first object and a second object, the method comprising:placing at least one insert at a location in a space formed between thefirst object and the second object; introducing a filler materialproximal to the location; and forming a plurality of inter-diffusionlayers, wherein a first inter-diffusion layer is formed between thefiller material, the at least one insert and the first object, wherein asecond inter-diffusion layer is formed between the filler material, theat least one insert and the second object.